Delivery systems for efficient vaporization of precursor source material

ABSTRACT

A delivery system for vaporizing and delivering vaporized solid and liquid precursor materials at a controlled rate having particular utility for semiconductor manufacturing applications. The system includes a vaporization vessel, a processing tool and a connecting vapor line therebetween, where the system further includes an input flow controller and/or an output flow controller to provide a controlled delivery of a vaporizable source material to the vaporization vessel and a controlled flow rate of vaporized source material to the processing tool.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of U.S. patent application Ser. No. 10/625,179filed Jul. 23, 2003 in the names of Luping Wang, et al. for “DeliverySystems for Efficient Vaporization of Precursor Source Material,” issuedJun. 21, 2005 as U.S. Pat. No. 6,909,839.

BACKGROUND OF INVENTION

1. Field of the Invention

The present invention relates to a vapor delivery system, and moreparticularly, to a system for delivering a controlled and stable vaporflow of vaporized liquid and solid source materials for use in chemicalvapor deposition (CVD) and ion implantation processes.

2. Description of the Related Art

Chemical vapor deposition (CVD) has been extensively used forpreparation of films and coatings in semiconductor wafer processing. CVDis a favored deposition process in many respects, for example, becauseof its ability to provide highly conformal and high quality films, atrelatively fast processing times. Further, CVD is beneficial in coatingsubstrates of irregular shapes including the provision of highlyconformal films even with respect to deep contacts and other openings.

In general, CVD techniques involve the delivery of gaseous reactants tothe surface of a substrate where chemical reactions take place undertemperature and pressure conditions that are favorable to thethermodynamics of the desired reaction. The type and composition of thelayers that can be formed using CVD is limited by the ability to deliverthe reactants or reactant precursors to the surface of the substrate.Various liquid precursors are successfully used in CVD applications bydelivering the precursor vapor in carrier gas. For example, liquidprecursor can be delivered by bubbling carrier gas at a controlled ratethrough a container of the vaporized precursor. The carrier gas issaturated with vaporized liquid precursor and is then transported to theCVD reaction chamber.

Analogous attempts have been made to deliver solid reactants to a CVDreaction chamber, but with much less success. The delivery of solidprecursors in CVD processing is carried out using the sublimator/bubblermethod in which the precursor is usually placed in a bubbler reservoirwhich is then heated to a temperature at which the precursor has areasonable vapor pressure. The precursor vapor then is transported intothe CVD reactor with a carrier gas such as hydrogen, helium, argon, ornitrogen. However, this procedure has proven to be problematic becauseof the inability to deliver, at a controlled rate, a reproducible flowof vaporized solid precursor to the process chamber.

Similar problems are inherent in conventional ion implantation systemswherein a dopant element is ionized and then subsequently accelerated toform an ion beam directed at a workpiece surface for implantation. Inion implantation processes, there are a number of frequently useddopants, such as arsenic, phosphorus, boron, antimony, indium, etc.Ideally, the dopant is delivered as a gas. However, a solid compound maybe delivered via a heated vaporization vessel, which usually does nothave any flow control devices. As such, the vapor flow rate often varieswith time, due to temperature and changes in the solid surface area.

Solid ion source material is greatly preferred for safety reasons,however, solid semiconductor dopants have presented serious technicaland operating problems. For instance, the changing surface area of thebulk solid precursor produces a continuously changing rate ofvaporization, particularly for thermally sensitive compounds. Thisever-changing rate of vaporization results in a continuously changingand non-reproducible flow of vaporized solid precursor for use in theprocess chamber. Thus, at present, processes using such vaporized solidprecursors cannot be controlled adequately and effectively.

In typical systems used for CVD and ion implantation, it is necessary toprecisely meter the output mass flow rate of vaporized constituents.Regulation of vapor mass flow is accomplished in the prior art invarious ways. For example, the temperature and pressure of the materialin the vaporizer are closely regulated to maintain a constant flow ofvapor-phase material. Also, the flow rate of a carrier gas through thevaporizer is controlled in an attempt to completely saturate the carriergas with vaporized source material. However, these methods still presentproblems because of the variations in the amount of source materialbeing vaporized within the vessel before combining with the carrier gas.

Accordingly, there is need in the art for a vaporizer system thatefficiently vaporizes and delivers vaporized solid or liquid sourcematerials at a highly controllable and reproducible flow rate.

SUMMARY OF THE INVENTION

The present invention relates to a delivery system for vaporizing anddelivering of vaporized solid and liquid precursor materials at areproducible and controlled rate having particular utility forsemiconductor manufacturing applications.

In one aspect, the present invention relates to a vapor delivery systemfor vaporization and delivery of a vaporized source material comprisinga vaporization vessel enclosing an interior volume, wherein thevaporization vessel comprises a heating means for vaporizing a sourcematerial; an inlet port for introducing a source material and outletport for discharging vaporized source material; a processing toolpositioned downstream from the vaporization vessel, a heatableconnecting vapor line positioned between the vaporization vessel andprocessing tool and in fluid communication therewith; and additionallyat least one of the features of:

-   -   a) a mass flow controller in fluid communication with the        connecting vapor line to provide a controlled flow of vaporized        source material from the vaporization vessel to the processing        tool;    -   b) a constant flow control valve in fluid communication with the        connecting vapor line, wherein the control valve has an orifice        sized to provide a controlled and fixed flow of vaporized source        material to the processing tool via the connecting vapor line;    -   c) an adjustable needle valve connected to the outlet port of        the vaporization vessel, wherein the opening of the needle valve        is continuously adjusted based on the vapor pressure within the        vaporization vessel to provide a controlled and constant flow of        vaporized source material to the processing tool via the        connecting vapor line;    -   d) a Knudsen cell structure integral to the vaporization vessel        or connected to the outlet port of the vaporization vessel,        wherein the Knudsen cell has an orifice sized to provide a        controlled and constant flow of vaporized source material to        processing tool via the connecting vapor line;    -   e) a syringe system for accurately delivering a controlled        amount of a liquid source material into the vaporization vessel        for vaporization therein; or    -   f) a screw delivery device for accurately delivering a solid        source material into the vaporization vessel for vaporization        therein.

In another aspect, the present invention relates to a vapor deliverysystem for vaporization delivery of a vaporized source material,comprising:

-   -   a) a vaporization vessel for holding a vaporizable source        material comprising an input port for introducing a source        material and outlet port for discharging vaporized source        material; and a vaporization means for vaporizing the        vaporizable source material, wherein the vaporization means is        selected from the group consisting of an electrical energy        emitting device, a liquid heating medium and electromagnetic        radiation device emitting wavelengths ranging from about 1 meter        to about 10⁻⁸ meter;    -   b) a processing tool positioned downstream from the vaporization        vessel;    -   c) a connecting vapor line positioned between the vaporization        vessel and processing tool and in fluid communication therewith;        and additionally at least one of the features of:        -   1) a mass flow controller in fluid communication with the            connecting vapor line to provide a controlled flow of            vaporized source material from the vaporization vessel to            the processing tool;        -   2) a constant flow control valve in fluid communication with            the connecting vapor line to provide a controlled flow of            vaporized source material from the vaporization vessel to            the processing tool, wherein the control valve has an            orifice sized to provide a fixed flow rate of vaporized            source material to the processing tool via the connecting            vapor line;        -   3) an adjustable needle valve connected to the outlet port            of the vaporization vessel, wherein the opening of the            needle valve is continuously adjusted based on the vapor            pressure within the vaporization vessel to provide a            controlled and constant flow of vaporized source material to            the processing tool via the connecting vapor line;        -   4) a Knudsen cell structure integral to the vaporization            vessel or connected to the outlet port of the vaporization            vessel, wherein the Knudsen cell has an orifice sized to            provide a controlled and constant flow of vaporized source            material to processing tool via the connecting vapor line;        -   5) a syringe system for accurately delivering a controlled            amount of a liquid source material into the vaporization            vessel for vaporization therein; or        -   6) a screw delivery device for accurately delivering a solid            source material into the vaporization vessel for            vaporization therein.

In yet another aspect of the present invention relates to a vapordelivery system for vaporization and delivery of a vaporized sourcematerial, the system comprising:

-   -   a) a vaporization vessel for holding a vaporizable source        material comprising an input port for introducing a vaporizable        source material, an outlet port for discharging vaporized source        material, and means for vaporization of the vaporizable source        material;    -   b) a processing tool positioned downstream from the vaporization        vessel;    -   c) a connecting vapor line positioned between the vaporization        vessel and processing tool and in fluid communication therewith;    -   d) input flow control means for introducing a constituent and        reproducible flow of a vaporizable source material into the        vaporization vessel; and    -   e) output flow control means for delivering a constant flow rate        of the vaporized source material from the vaporization vessel to        the processing tool.

Still another aspects of the present invention provides for a method fordelivering a vaporized source material to a processing tool, the methodcomprising:

-   -   a) introducing a controlled flow of a vaporizable source        material into a vaporization vessel;    -   b) vaporizing a source material in the vaporization vessel to        generate a vaporized source material;    -   c) discharging the vaporized source material from the        vaporization vessel; and    -   d) adjusting the flow rate of the discharged vaporized source        material by passing through a flow controller to provide a        controlled and constant flow of source material to the        processing tool.

Other aspects and features of the invention will be more fully apparentfrom the ensuing disclosure and appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram setting forth the basic components of oneembodiment of the vaporization system of present invention.

FIG. 2 is a cross-sectional view of a vaporization vessel of the presentinvention illustrating use of a resistant heating means for vaporizationof source material therein.

FIG. 3 is a cross-sectional view of a vaporization vessel of the presentinvention illustrating use of an inductive coil for vaporization ofsource material therein.

FIG. 4 is a cross-sectional view of a vaporization vessel of the presentinvention illustrating use of an electromagnetic radiation device forvaporization of source material therein.

FIG. 5 is a cross-sectional view of a vaporization vessel of the presentinvention illustrating use of a circulating heat transferring liquidmedium for vaporization of source material therein.

FIG. 6 is a cross-sectional view of a vaporization vessel of the presentinvention illustrating a Knudsen cell integral to the vaporizationvessel for a controlled flow of vaporized source from the vaporizationvessel.

FIG. 7 is a cross-sectional view of a vaporization vessel of the presentinvention illustrating a separate Knudsen cell connected to thevaporization vessel for a controlled flow of vaporized source materialfrom the vaporization vessel.

DETAILED DESCRIPTION OF THE INVENTION AND PREFERRED EMBODIMENTS THEREOF

A delivery system in accordance with one embodiment of the presentinvention and illustrated in FIG. 1 overcomes the deficiencies of priorart delivery systems for vaporized source materials. The delivery system10 comprises a vaporization vessel 12, which generally has a shape tofacilitate the easy mixing of a carrier gas with the vaporized sourcematerial. Preferably, the vaporization vessel has a shape of a sphere,ellipsoid, barrel, cylinder, cone or a combination of these shapes. Thevaporization vessel can be fabricated of a suitable heat-conductingmaterial, such as, for example, silver, silver alloys, copper, copperalloys, aluminum, aluminum alloys, lead, nickel clad, stainless steel,graphite and/or ceramic material. The vessel is fabricated from amaterial that does not chemically react with the source material. Otherapplicable vaporization vessels are disclosed in copending applicationsU.S. patent application Ser. Nos. 10/288,743 and 10/201,518, the entiredisclosures of which are incorporated herein by reference.

The vaporization vessel comprises a bottom 16 and sidewalls 14 to forman interior volume 15 for holding a vaporizable source material.Further, the vaporization vessel comprises an inlet port 19 forintroducing a source material before initiation of the vaporizationprocess, wherein the source material can be stored in reservoir 13 andoptionally introduced by input flow control means 11. The vaporizationvessel may further comprise an inlet 33 for introduction of a carriergas for mixing with the vaporized source material. The carrier gas maybe any inert gas, such as argon, helium or neon.

The vaporization delivery system may further comprise a vacuum pump andvalve system 37 communicatively connected to the vaporization vessel.The vacuum pump and valve system may be utilized to evacuate thevaporization vessel.

The vapor delivery system of the present invention further comprises avaporization means to effectuate the vaporization of the sourcematerial, wherein the vaporization means may include a heating means 18to surround at least the bottom and a portion of the side walls of thevaporization vessel. Any heating means that increases the temperaturewithin the vessel to a temperature sufficient to vaporize the desiredprecursor source material may be used in the present invention.Depending on the vaporizable source material, the operating conditionsof the processing tool, the vapor pressure and amount of the vaporizablesource material, the temperature suitable for sublimation orvaporization may be in the range from about 30° C. to about 800° C., andmore preferably from about 50° C. to about 250° C.

Specifically, the heating device may include resistive heating systems,block heaters, an induction heating coil operated by an rf power supplyand/or a circulating liquid medium that transfers heat to thevaporization vessel.

Further, the vaporization energy can be provided by a device thattransmits electromagnetic energy 17 having wavelengths ranging fromabout 1 meter to about 10⁻⁸ and more preferably from about 10⁻² to about10⁻⁸ meters. Preferably, the vaporization energy utilizes infrared,ultraviolet, or ultrasonic radiation frequencies that may be transmittedinto the vaporization vessel through the bottom, sidewall and/or aradiation transparent cover.

In one preferred embodiment, as shown in FIG. 2, at least one resistor30, and more preferably at least four resistors (resistive heatingelements), are positioned on the outer surfaces of the vaporizationvessel, fabricated as a conductive block, to supply sufficient heat tovaporize the enclosed material and provide a consistent temperaturethroughout the entire volume of the conductive block. One skilled in theart will be able to adjust the temperature of the vaporizer to achievethe best results for each specific source material. Temperature withinthe conductive block may be sensed by a thermocouple 32 or any othersuitable temperature sensing device arranged for contacting a surface ofthe thermally conductive block. The system may be arranged as shown inFIG. 1, including a temperature controlling device that obtains an inputtemperature from the conductive block via thermocouple 32 and outputs acontrol signal to resistors 30 so that the conductive block is heatedand maintained at a suitable temperature.

Additionally, vaporization of a source material may be accomplished bysurrounding the vaporization vessel with an induction heating coil 41located external to the vaporization vessel, as shown in FIG. 3. Theinduction coil may be operated by rf power supply (not shown), which iscontrolled by feedback from a thermocouple 32 embedded within thevessel. Preferably, the induction coil is positioned to reduce “coldspots” in the vaporizer thereby substantially eliminating depositionand/or condensation of vaporized material within the vaporizer.

Vaporization of a source material may also be achieved by using anydevice capable of generating and transmitting acoustic energy throughany medium to transit ultrasonic atomizing energy. FIG. 4 shows anultrasonic emitting device 17 that can be used to generate acousticfrequencies for vaporization of a source material. The ultrasonicemitting device can be placed in either the interior of the vaporizationvessel or positioned adjacent thereto for transmitting energy into thevaporization vessel. The device may include components for thetraditional electromagnetic stimulation of piezoelectric transducers,(man-made or naturally occurring), purely mechanical devices (such ashigh frequency air whistles), and laser devices. Individual componentsfor acoustic energy systems are commercially available from a widevariety of manufacturers, which can be configured to particularapplications and frequency ranges. (See Thomas Directory of AmericanManufacturers, Photonics Buyer's Guide, 1996, Microwave and RF, andElectronic Engineer's Master Catalogue).

Any oscillator or signal generator 38 that produces a signal withpredetermined characteristics such as frequency, mode, pulse duration,shape, and repetition rate may be used to generate acoustic frequenciesfor vaporization in the present invention. Various oscillators or signalgenerators can be commercially purchased from a wide variety ofmanufacturers and in a variety of designs configured to particularapplications and frequencies. Applicable transducers will include typesthat produce an acoustic wave within a range of frequencies (broadband)or for one specific frequency (narrowband) for frequencies ranging fromhertz to gigahertz.

The acoustic delivery system will be variable depending on theapplication. For example, acoustic energy waves can be transmitted intoliquid or solid source material either by direct contact of the sourcematerial with a transducer, or by coupling of transmission of theacoustic wave through another medium, which is itself in direct contactwith the source material. If the source material is a liquid, atransducer can be placed in the liquid source material, or the walls ofthe vaporization vessel can be fabricated of a material that acts as atransducer thereby placing the liquid source material in direct contactwith the transducer. Additionally, an acoustic energy emitting devicemay be positioned on the exterior of the vaporization vessel fortransmitting the appropriate energy through a beam port 21 in uppersealable lid 23 of the vaporization vessel. If the source material is asolid, a transducer can be placed in direct contact with it or the solidsource material can be placed in a gas or liquid that is used as acoupling agent.

In the ultrahigh acoustic frequencies (upper GHZ and THz) any lasersystem that generates acoustic energy may be utilized. If the device ispositioned on the outside of the vessel, the ultrasonic device should bepositioned at either input port 19 or for transmission through beam port21 which may be constructed of a frequency transmitting material.Preferably, the output of the ultrasonic generator is of a sufficientfrequency to atomize the liquid or solid source material. For example,using the power output of 0.5 to 5 W at a frequency of 40 to 120 kHz, aliquid material can be atomized into fine particles. When an ultrasonicdevice is utilized, the vaporization vessel may further include a heatermeans 18 to ensure that the atomized material is completely vaporizedbefore transporting to the processing chamber.

To obtain the maximum transfer of acoustical energy from one medium toanother, the characteristic acoustical impedance of each medium ispreferably as nearly equal to the other as possible. The matching mediumis sandwiched between the other two and should be the appropriatethickness relative to the wavelength of the sound transmitted, and itsacoustical impedance R should be nearly equal to (R₁R₂). Any impedancematching device that is commercially available can be utilized in thepresent invention.

The vaporization system of the present invention may further comprise alight or laser source for directing an energy beam on the sourcematerial. The laser beam may be positioned adjacent to the vaporizationvessel for directing the beam through the beam port 21. The laser may beany device capable of focusing an energy beam at a particular point onthe solid or liquid source material for vaporization. For example, thelaser may transmit infrared or UV energy. If the laser chosen is an IRlaser, the beam port window 21 preferably is an IR transparent windowformed of an IR transparent material such as, for example, NaCl or CsI.

FIG. 5 illustrates another type of heating device comprising a liquidheating medium having a high heat capacity to heat the vaporizationvessel sufficiently to vaporize the source material therein. The heatingmedium may comprise, for example, mineral oil or water. The vaporizationvessel, as shown in FIG. 5, is properly constructed to accommodateinternal tubing 40 within the sidewall and bottom of the vaporizationvessel for circulating the heating medium therethrough to providesufficient transfer of heat to the vaporization vessel for vaporizingthe source material therein.

The output flow control means 24, as shown in FIG. 1, comprises at leasta valve, a feedback control circuit and an associated proportionalsolenoid or the like so that the valve can be electronically controlledremotely by a microprocessor (CPU) 31. With particular reference to theindividual components, the output flow control means may comprise arotameter/needle valve assembly for controlling the flow of vaporizedsource material from outlet port 20 of the vaporization vessel to theprocessing tool. Preferably, the needle valve is an air-operated device,designed to apply precise and repeatable amounts of vaporized sourcematerial dependent on several variables including, valve open time,fluid pressure, flow control adjustment, dispense tip diameter and fluidviscosity. Various needle flow valves for this purpose are commerciallyavailable, as will be apparent to those skilled in the art.

In another embodiment, the output flow control means may include aconstant flow control valve equipped with an orifice sized to deliver aspecific flow rate ranging from about micromillilters to about litersper minute. The constant flow control valve is in fluid communicationwith outlet port 20 of the vaporization vessel. Preferably, the orificeof the constant flow control valve is sized proportionally to a fixedflow rate thereby providing a controlled and constant flow of vaporizedsource material to the processing tool 35 via the connecting vapor line26. The constant flow control valve may further include a diaphragmwhich is resiliently biased into a normally closed position, and whichshifts to an open position when exposed to a fluid pressure above apredetermined minimum level. Thus, the constant flow valve automaticallycloses when the fluid delivery pressure is below the predeterminedminimum level and automatically opens when the fluid delivery pressuresexceeds that minimum level thereby maintaining a substantially constantflow of the vaporized source material through the connecting vapor line26 to the processing tool. The use of a constant flow control valve,with any of the vaporization vessels discussed in FIGS. 2-5, providesfor a flow rate that will remain essentially constant, even with varyingpressures ranging from about 15 PSI to 125 PSI and varying fluidviscosities ranging from about 400 SSC to about 700 SSC. Variousconstant flow control valves for this purpose are commerciallyavailable, as will be apparent to those skilled in the art.

In yet another embodiment, the output flow control means may include amass flow controller (MFC) in fluid communication with output port 20 ofthe vaporization vessel to control the flow of vaporized source materialto the downstream processing tool 35. Depending on the vaporized sourcematerial and the final processing system, the flow of material throughthe mass flow controller may range from about 1 sccm to 50 sccm, andmore preferably, from about 1 to about 20 sccm. Positioned in fluidcommunication with connecting line 26 the mass flow controller, having avariable valve, can accommodate different flow rates, set points andpressures. Preferably, the MFC is communicatively connected to a CPU 31for adjusting the valve positioning thereby compensating for thepressure and density of the gas that actually is flowing through the MFCto maintain sufficient flow into the processing tool.

The vaporization system of the present invention may further comprise anoutput flow control valve that is either integral to the vaporizationvessel or attached thereto. A Knudsen-type cell structure, as shown inFIG. 6, provides high reproducibility and consistent rates ofvaporization thereby providing for consistent flow of vaporized sourcematerial from the vaporization vessel for reproducible deposition in theprocessing tool. The vaporization-Knudsen-type vessel comprises aknife-edge orifice 34 that can be fabricated directly into thevaporization vessel upper cover 23. The size of the orifice is generallydetermined by the maximum vapor pressure over the sample in thetemperature range of interest. The vaporized source material will effusethrough the small orifice of the vessel in a consistent flow dependenton the pressure gradient within the vessel. Preferably, the vaporizablesurface of the source material within the vessel is large compared tothe size of the orifice to maintain an equilibrium pressure within thevaporization vessel. More preferably, the orifice width to the interiorcross-sectional area of the vaporization vessel ranges from about 1:100to about 1:5 and the orifice diameter ranges from about 0.5 to about 50mm to ensure molecular flow is maintained as the vaporized sourcematerial passes through the orifice 34. The shape of the vaporizationvessel has a tube-like configuration, which provides sufficient surfacearea for both solid and liquid source materials.

Temperature within the vaporization-Knudsen-type vessel should bemaintained at a constant temperature so that temperature gradients areeliminated. Thus, the internal temperature may be monitored with athermocoupling 32 positioned within the vessel. Any suitableelectrically conductive heat resistive material may be utilized to heatthe vaporization vessel. Generally, the resistance heatable vaporizationvessels have a resistance range of between about 10⁻² ohms and about 10³ohms. The specific resistivity selected depends upon the electricalpower supply utilized and the electrically conductive heat resistantmaterials used to fabricate the vessel that may include stainless steel,tantalum, tungsten, molybdenum, Hastelloy™, and the like. Any suitablemeans such as flanges fastened to the vaporization vessel may beutilized to facilitate attachment of electrical connections. Thetemperature may be controlled by a PID feedback circuit coupled to a SSRto control the temperature within the vessel.

FIG. 7 illustrates another embodiment of the present invention wherein aKnudsen-type cell structure 43 is connected to the vaporization vesselthrough output port 20. The vaporized source material is introduced intothe Knudsen type cell structure from the vaporization vessel. The vaporsleave the Knudsen-type-cell structure through the orifice 34 having adiameter that will determine the residence time of the molecules. Thetwo separate chambers may be separated by a plunger in order to vaporizea controlled amount of source material vapor in the vaporization vessel12 and then the vapors effuse into the second chamber 43.

The source material may be introduced into the vaporization vessel 12via an input flow control means 11 to achieve a precise transfer ofsource material for vaporization. A liquid source material may beintroduced by utilizing a syringe-type piston pump that is capable ofdelivering an accurate liquid delivery rate which in turn provides anaccurate vapor flow rate when the liquid source material vaporizes inthe vaporization vessel. For a solid source material, an accurate andconstituent delivery amount may be achieved by utilizing a screwdelivery device that delivers accurate and repeatable dots or beads ofthe source material to the heated vaporization vessel. Any commerciallyavailable positive displacement screw device may be utilized in thepresent invention.

Introduction of the source material to the vaporization vessel and flowof the vaporized source material between the vaporizer and processingchamber is controlled by the CPU 31. As shown in FIG. 1, the CPU may bearranged to actuate the input and output flow controllers and/or monitorheating temperature and pressure within the vaporization vessel by meansof a signal transmission line 39, which convey signals received fromvarious other components to the CPU.

While the invention has been described herein with reference to specificfeatures, aspects and embodiments, it will be recognized that theinvention may be widely varied, and that numerous other variations,modifications and other embodiments will readily suggest themselves tothose of ordinary skill in the art. Accordingly, the ensuing claims areto be broadly construed, as encompassing all such other variations,modifications and other embodiments, within their spirit and scope.

1. A vapor delivery system for vaporization and delivery of a vaporizedsource material comprising a vaporization vessel enclosing an interiorvolume, wherein the vaporization vessel comprises a heater forvaporizing a source material; an inlet port for introducing a sourcematerial and an outlet port for discharging vaporized source material; aprocessing tool positioned downstream from the vaporization vessel; aconnecting vapor line positioned between the vaporization vessel andprocessing tool and in fluid communication therewith; and additionallyat least one flow control feature comprising: a) a mass flow controllerin fluid communication with the connecting vapor line to provide acontrolled flow of vaporized source material from the vaporizationvessel to the processing tool; b) a constant flow control valve in fluidcommunication with the connecting vapor line, wherein the control valvehas an orifice sized to provide a controlled and constant flow ofvaporized source material to the processing tool via the connectingvapor line; c) an adjustable needle valve connected to the outlet portof the vaporization vessel, wherein the opening of the needle valve iscontinuously adjusted based on the vapor pressure within thevaporization vessel to provide a controlled and constant flow ofvaporized source material to the processing tool via the connectingvapor line; d) a Knudsen cell structure integral to the vaporizationvessel or connected to the outlet port of the vaporization vessel,wherein the Knudsen cell has an orifice sized to provide a controlledand constant flow of vaporized source material to processing tool viathe connecting vapor line; e) a syringe system for accurately deliveringa controlled amount of a liquid source material into the vaporizationvessel for vaporization therein; or f) a screw delivery device foraccurately delivering a solid source material into the vaporizationvessel for vaporization therein.
 2. The vapor delivery system accordingto claim 1, wherein the system comprises Knudsen cell structure integralto the vaporization vessel.
 3. The vapor delivery system according toclaim 1, further comprising a central processing unit communicativelylinked to the at least one control feature for adjustment of flow intoor out of the vaporization vessel.
 4. The vapor delivery systemaccording to claim 1, further comprising a carrier gas source in fluidcommunication with the vaporization vessel.
 5. The vapor delivery systemaccording to claim 1, wherein the system comprises a Knudsen cellstructure connected to the outlet port of the vaporization vessel. 6.The vapor delivery system according to claim 1 further comprising aheater for heating the connecting vapor line.
 7. The vapor deliverysystem according to claim 1, wherein the system comprises the mass flowcontroller and the screw delivery device.
 8. The vapor delivery systemaccording to claim 6, wherein the heater is selected from the groupconsisting of electrical, liquid, and electromagnetic radiation havingwavelengths from 10⁻² to 10⁻⁸ meters.
 9. The vapor delivery systemaccording to claim 1, wherein the system comprises the constant flowcontrol valve and the system is heated by an ultrasonic laser positionedadjacent to the vaporization vessel.
 10. The vapor delivery systemaccording to claim 1, wherein the system comprises a Knudsen cellstructure connected to the outlet port of the vaporization vessel and amass flow control valve.
 11. A vapor delivery system for vaporizationdelivery of a vaporized source material, comprising: a) a vaporizationvessel for holding a vaporizable source material comprising an inputport for introducing a source material and an outlet port fordischarging vaporized source material; and a vaporizer for vaporizingthe vaporizable source material, wherein the vaporizer is selected fromthe group consisting of an electrical energy emitting device, a liquidheating medium and electromagnetic radiation device emitting wavelengthsranging from about 10⁻² to about 10⁻⁸ meters; b) a processing toolpositioned downstream from the vaporization vessel; c) a connectingvapor line positioned between the vaporization vessel and processingtool and in fluid communication therewith; and additionally at least oneof the features of: 1) a mass flow controller in fluid communicationwith the connecting vapor line to provide a controlled flow of vaporizedsource material from the vaporization vessel to the processing tool; 2)a constant flow control valve in fluid communication with the connectingvapor line, wherein the constant flow control valve has an orifice sizedto provide a controlled and constant flow of vaporized source materialto the processing tool via the connecting vapor line; 3) an adjustableneedle valve connected to the outlet port of the vaporization vessel,wherein the opening of the needle valve is continuously adjusted basedon the vapor pressure within the vaporization vessel to provide acontrolled and constant flow of vaporized source material to theprocessing tool via the connecting vapor line; 4) a Knudsen cellstructure integral to the vaporization vessel or connected to the outletport of the vaporization vessel, wherein the Knudsen cell has an orificesized to provide a controlled and constant flow of vaporized sourcematerial to processing tool via the connecting vapor line 5) asyringe-type pump system for accurately delivering a controlled amountof a liquid source material into the vaporization vessel forvaporization therein; or 6) a screw delivery device for accuratelydelivering a solid source material into the vaporization vessel forvaporization therein.
 12. The vapor delivery system according to claim11, wherein the system comprises a syringe for introducing a controlamount of source material to the vaporization vessel and a mass flowcontroller for controlling the amount of vaporized source materialintroduced into process tool.
 13. The vaporized delivery systemaccording to claim 12, wherein the heater comprises resistance heater.14. The vapor delivery system according to claim 11, wherein the systemcomprises a syringe for introducing a control amount of source materialto the vaporization vessel and a Knudsen-type-cell structure forcontrolling the amount of vaporized source material introduced intoprocess tool.
 15. The vapor delivery system according to claim 11,wherein the system comprises a screw device for introducing a controlamount of source material to the vaporization vessel and aKnudsen-type-cell structure for controlling the amount of vaporizedsource material introduced into process tool.
 16. The vapor deliverysystem according to claim 15, wherein the heater to heat theKnudsen-type-cell structure comprises a resistance heater.
 17. A vapordelivery system for vaporization and delivery of a vaporized sourcematerial, the system comprising: a) a vaporization vessel for holding avaporizable source material comprising an input port for introducing asource material; an outlet port for discharging vaporized sourcematerial; and a vaporizer for vaporizing the vaporizable source materialwithin the vaporized vessel; b) a processing tool positioned downstreamfrom the vaporization vessel; c) a connecting vapor line positionedbetween the vaporization vessel and processing tool and in fluidcommunication therewith; d) an input flow controller for introducing aconstituent and reproducible flow of a vaporizable source material intothe vaporization vessel; and e) an output flow controller for deliveringa constant flow rate of the vaporized source material from thevaporization vessel to the processing tool.
 18. The vapor deliverysystem according to claim 17, wherein the system comprises a syringe forintroducing a control amount of source material to the vaporizationvessel and a constant control valve for controlling the amount ofvaporized source material introduced into process tool.
 19. The vapordelivery system according to claim 17, wherein the system comprises ascrew delivery device for introducing a control amount of sourcematerial to the vaporization vessel and a Knudsen-type-cell structurefor controlling the amount of vaporized source material introduced intoprocess tool.
 20. The vapor delivery system according to claim 19,wherein the vaporizer comprises ultrasonic energy.